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study programme
Original title in Czech: Návrh čipů a moderní polovodičové technologieFaculty: FEECAbbreviation: MPC-NCPAcad. year: 2025/2026
Type of study programme: Master's
Study programme code: N0714A060025
Degree awarded: Ing.
Language of instruction: Czech
Accreditation: 4.6.2024 - 4.6.2034
Profile of the programme
Academically oriented
Mode of study
Full-time study
Standard study length
2 years
Programme supervisor
doc. Ing. Jiří Háze, Ph.D.
Fields of education
Study aims
The two-year follow-up master degree program Chip Design and Modern Semiconductor Technologies (MPC-NCP) is aimed to educate future engineers with a broad base of knowledge of theory and practical applications in the field of material and electrical engineering in semiconductor, or electrotechnical industry. The aim of the master degree program is to offer a degree that is specifically focused in the area of the Semiconductor Value Chain (SVC) and that provides to students basic and advanced engineering knowledge and skills related to the theory, design, simulation, manufacturing, packaging, testing and application of integrated circuits and their integration in complex electrotechnical devices. Knowledge and skills in the field of semiconductor materials and technologies for the semiconductor industry are also a matter of the program. Thanks to the high-quality theoretical education and the broad professional basis of applied, industrially targeted field studies, the graduate's high adaptability to all specific requirements of his future professional practice is ensured.
Graduate profile
Graduates of the master study program Chip Design and Modern Semiconductor Technologies have comprehensive knowledge in the field of design and evaluation of integrated circuits, semiconductor technologies incl. SiC, GaN, technologies "beyond" CMOS and nanotechnology incl. MEMS/NEMS. Furthermore, they are able to design complex electronic systems and devices for use in various areas of electronics and electrical engineering, especially with regard to the semiconductor value chain - SVC (but not only here). Graduates have knowledge of electron microscopy and its use within SVC, knowledge of analog and digital signal processing, fabrication processes for SVC and more. As part of the optionality of his graduate profile, the student qualifies for the area of: design and computer simulation of integrated circuits (analog, digital, including RISC-V and mixed-signal architectures), semiconductor technology, design of electronic systems and application of microelectronic circuits for instrumentation, electronic systems technology , design and production of printed circuit boards, surface assembly technology, test and measurement technology, economy and organization of production. All graduates will have completed an internship at one of the collaborating workplaces (industrial company, university in the Czech Republic or abroad) and will also complete at least two professional subjects taught entirely in English. Graduates will also participate in one of the workshops organized in cooperation with Taiwanese partners within the ACDRC (Advanced Chip Design and Research Center). The graduate is qualified in the design, simulation, technology, fabrication and application of integrated circuits, in the design, technology and application of electrical equipment, instrumentation, test and measurement technology, analog and digital signal processing. Thanks to a sufficiently broad base of theoretically and application-oriented studies, the graduate's high adaptability to all specific requirements of his future professional practice within the SVC, but also in other areas of electronics and electrical engineering, is ensured. Graduates are able to communicate and work in a team, are able to think in context, critically evaluate information sources and prepare high-quality research and professional projects. The graduate will acquire basic engineering knowledge and skills, which will professionally profile him especially in areas related to: - technologies and semiconductor materials for chip production, - design and simulation of basic and advanced chip structures, - the utilization of supporting simulation EDA tools for chip design, - chip packaging and evaluation using modern methods such as electron microscopy, - the design of complex electronic systems and devices for the area of the semiconductor value chain, as well as other areas of electronics, - with optoelectronics or photonics within the semiconductor value chain, - and more.
Profession characteristics
Graduates of the program will be employed especially in the Czech Republic (but generally worldwide) in the field of the semiconductor value chain – semiconductor materials and production technologies, design, fabrication, packaging and testing of chips, implementation in advanced electronic systems. Furthermore, in areas such as optoelectronics, photonics, nanoelectronics or analytics (electron microscopy) and other branches of the electrical industry.
What degree programme types may have preceded
The graduates may continue in a doctoral study programme.