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FEEC, UMEL – Associate professor
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2023
OTÁHAL, A.; GABLECH, I.; SKÁCEL, J.; SZENDIUCH, I. Investigation of the Influence of Dam and Fill Encapsulating Material Shrinkage on a Semiconductor Substrate Warpage. In Proceedings of the International Spring Seminar on Electronics Technology. 2023. ISBN: 979-8-3503-3484-5.Detail
2022
SZENDIUCH, I.; HURBAN, M. Measuring of Gas Flow Speed in Reflow Furnace. In 2022 45th International Spring Seminar on Electronics Technology (ISSE). International Spring Seminar on Electronics Technology ISSE. IEEE, 2022. p. 1-5. ISBN: 978-1-6654-6589-2. ISSN: 2161-2536.Detail | WWW
2021
OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I.; BÚRAN, M. Comparison of Sample Preparation with Microsection and FIB Depending on the Detail of Structure. In 2021 44th International Spring Seminar on Electronics Technology (ISSE). International Spring Seminar on Electronics Technology ISSE. IEEE, 2021. p. 1-6. ISBN: 978-1-6654-1477-7. ISSN: 2161-2536.Detail | WWW
HURBAN, M.; SZENDIUCH, I. Vliv koeficientu přenosu tepla na pájení přetavením. ElectroScope - http://www.electroscope.zcu.cz. Plzen: 2021. p. 1-3. ISSN: 1802-4564.Detail | WWW
2020
SZENDIUCH, I. Experimental Teaching of Microelectronics Assembly Technology. The Educational Review, 2020, vol. 4, no. 2, p. 263-269. ISSN: 2575-7946.Detail | WWW | Full text in the Digital Library
OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I. Investigation of Metallographic Etchants Selectivity for Tin Solder Alloys. In 2020 43rd International Spring Seminar on Electronics Technology (ISSE). International Spring Seminar on Electronics Technology ISSE. IEEE, 2020. p. 1-6. ISBN: 978-1-7281-6773-2. ISSN: 2161-2536.Detail | WWW
OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I.; JANKOVSKÝ, J. Current Load of Thick-film Pastes for Power Applications. In 2020 43rd International Spring Seminar on Electronics Technology (ISSE). International Spring Seminar on Electronics Technology ISSE. IEEE, 2020. p. 1-6. ISBN: 978-1-7281-6773-2. ISSN: 2161-2536.Detail | WWW
SZENDIUCH, I.; HEJÁTKOVÁ, E.; HURBAN, M.; SKÁCEL, J. Ecolabeling of Electronics Products – what is new and what next?. In Electronics Technology (ISSE), 2020 43rd International Spring Seminar. International Spring Seminar on Electronics Technology ISSE. Institute of Electrical andElectronics Engineering (IEEE). Košice, slovensko: IEEE Computer Society, 2020. p. 151-154. ISBN: 9781538657300. ISSN: 2161-2536.Detail | WWW
2019
SITKO, V.; SZENDIUCH, I. Optical method for validation of changes in the cleaning process and cleaning process optimization. In 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). 1. Pisa: IMAPS Europe, 2019. p. 1-8. ISBN: 978-0-9568086-6-0.Detail | WWW
SZENDIUCH, I.; HURBAN, M. Measurement of Gas Flow in Reflow Oven. In 2019 42nd International Spring Seminar on Electronics Technology (ISSE). International Spring Seminar on Electronics Technology ISSE. Institute of Electrical andElectronics Engineering (IEEE). Wroclaw, Poland: IEEE Computer Society, 2019. p. 151-154. ISBN: 9781538657300. ISSN: 2161-2536.Detail | WWW
OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I. New Possible Way for Brazing of Thick Film Cermet Conductors. In 42nd International Spring Seminar on Electronics Technology (ISSE). Electronics Technology (ISSE). IEEE, 2019. p. 1-5. ISSN: 2161-2528.Detail | WWW
OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I. Influence of Electric Current at Solidification of Solder. In 42nd International Spring Seminar on Electronics Technology (ISSE). Electronics Technology (ISSE). IEEE, 2019. p. 1-5. ISSN: 2161-2528.Detail | WWW
HURBAN, M.; SZENDIUCH, I. Smart sensors – another foundation for Industry 4.0. ElectroScope - http://www.electroscope.zcu.cz. Plzen: 2019. p. 1-2. ISSN: 1802-4564.Detail | WWW
2018
SZENDIUCH, I. Pájení laserem a specifika pájecí pasty. DPS Elektronika od A do Z, 2018, vol. 2018, no. 6, p. 32-34. ISSN: 1805-5044.Detail
SZENDIUCH, I.; HEJÁTKOVÁ, E.; HURBAN, M.; SKÁCEL, J. Eco-label and Self Environmental Claims in Electronics. In 2018 41st International Spring Seminar on Electronics Technology (ISSE 2018). International Spring Seminar on Electronics Technology ISSE. Institute of Electrical andElectronics Engineering (IEEE). Zlatibor, Serbia: IEEE Computer Society, 2018. p. 251-256. ISBN: 9781538657300. ISSN: 2161-2536.Detail | WWW
SZENDIUCH, I. COB I – přímá montáž polovodičových čipů na substrát. DPS Elektronika od A do Z, 2018, vol. 2018, no. 2, p. 34-35. ISSN: 1805-5044.Detail
SZENDIUCH, I. COB III připojování polovodičových čipů (materiály a testování). DPS Elektronika od A do Z, 2018, vol. 2018, no. 3, p. 34-36. ISSN: 1805-5044.Detail
SZENDIUCH, I. COB II – přímá montáž polovodičových čipů na substrát (technologický proces). DPS Elektronika od A do Z, 2018, no. 2, p. 34-35. ISSN: 1805-5044.Detail
SZENDIUCH, I. Technologie povrchové montáže – jaký je současný stav. DPS Elektronika od A do Z, 2018, no. 2, p. 40-41. ISSN: 1805-5044.Detail
Hurban, M, SZENDIUCH, I. Digitalisation and networking in “smart production”. ElectroScope - http://www.electroscope.zcu.cz, 2018, vol. 12, no. 1, p. 16-18. ISSN: 1802-4564.Detail | WWW
OTÁHAL, A.; SOMER, J.; SZENDIUCH, I. Influence of heating direction on BGA solder balls structure. In Microelectronics and Packaging Conference (EMPC) & Exhibition, 2017 21st European. 2018. p. 1-4. ISBN: 978-0-9568086-4-6.Detail | WWW
SZENDIUCH, I.; HEJÁTKOVÁ, E.; HURBAN, M. Gas flow and heat transfer in reflow oven. In 2018 41st International Spring Seminar on Electronics Technology. International Spring Seminar on Electronics Technology ISSE. Zlatibor, Serbia: IEEE Computer Society, 2018. p. 254-256. ISSN: 2161-2536.Detail | WWW
SKÁCEL, J.; SZENDIUCH, I.; OTÁHAL, A.; HEJÁTKOVÁ, E. X-ray Inspection of Ceramic Structures. In 2018 41st International Spring Seminar on Electronics Technology. International Spring Seminar on Electronics Technology ISSE. Zlatibor, Serbia: IEEE Computer Society, 2018. p. 254-257. ISSN: 2161-2536.Detail | WWW
SOMER, J.; URBAN, F.; SZENDIUCH, I.; URBAN, F. Optical pressure sensors for harsh environment. In Microelectronics and Packaging Conference (EMPC) & Exhibition, 2017 21st European. 2018. p. 1-5. ISBN: 978-0-9568086-4-6.Detail | WWW
OTÁHAL, A.; SZENDIUCH, I. Influence of heat flow direction on solder ball interfacial layer. Journal of Electrical Engineering, 2018, vol. 69, no. 4, p. 305-310. ISSN: 1339-309X.Detail | WWW | Full text in the Digital Library
SKÁCEL, J.; SZENDIUCH, I.; OTÁHAL, A. Creation of Cavities in High-temperature Ceramics. In 2018 41st International Spring Seminar on Electronics Technology. International Spring Seminar on Electronics Technology ISSE. Zlatibor, Serbia: IEEE Computer Society, 2018. p. 249-254. ISSN: 2161-2536.Detail | WWW
SZENDIUCH, I. COB IV připojování polovodičových čipů (nastavení procesu a poruchové mechanizmy). DPS Elektronika od A do Z, 2018, no. 2, p. 39-43. ISSN: 1805-5044.Detail
2017
SZENDIUCH, I. Kontaktování polovodičových čipů. 1. 1. Brno: Novpress, 2017. 61 p. ISBN: 978-80-214-5536-8.Detail
SZENDIUCH, I. IMAPS a inovační technologie v montážní mikroelektronice. Rožnov p. R.: PBT Rožnov p.R., 2017.Detail | WWW
SZENDIUCH, I. IMAPS -cesta k moderním technologiím. Brno: DPS od A do Z, 2017.Detail | WWW
SKÁCEL, J.; SZENDIUCH, I. PREDICTION OF THE THICK FILM RESISTOR TRIMMING. In Sborník IMAPS flash Conference 2017. ElectroScope - http://www.electroscope.zcu.cz. 2017. p. 19-22. ISBN: 978-80-214-5419-4. ISSN: 1802-4564.Detail
SZENDIUCH, I.; HURBAN, M. Gas flow and heat transfer in reflow owen. In 3rd IMAPS flash conference 2017. 1. Brno: Novpress s.r.o., 2017. p. 86-87. ISBN: 978-80-214-5535-1.Detail | WWW
SKÁCEL, J.; SZENDIUCH, I. Three ways to ceramic packages. In Electronics Technology (ISSE), 2017 40th International Spring Seminar on. International Spring Seminar on Electronics Technology ISSE. Volume 2017-September. Sofia, Bulgaria: IEEE Computer Society, 2017. p. 249-254. ISBN: 978-1-5386-0582-0. ISSN: 2161-2536.Detail | WWW
SKÁCEL, J.; SZENDIUCH, I.; NOVOTNÝ, V.; ŠANDERA, J. The analysis of reliability of solder joints on SMD ceramic resistor arrays. In Electronics Technology (ISSE), 2017 40th International Spring Seminar. Proceedings of the International Spring Seminar on Electronics. Volume 2017-September. Sofia, Bulgaria: IEEE Computer Society, 2017. p. 240-245. ISBN: 978-1-5386-0582-0. ISSN: 21612528-.Detail | WWW
SZENDIUCH, I. IMAPS a rostoucí význam pouzdření v moderní mikroelektronice. DPS Elektronika od A do Z, 2017, vol. 25, no. 3, p. 40-43. ISSN: 1805-5044.Detail
2016
SZENDIUCH, I.; HURBAN, M. Reflow Soldering in Vapour Phase Systems. In 2nd IMAPS FLASH CONFERENCE 2016. 1. Brno: Novpress s.r.o., 2016. p. 42-43. ISBN: 978-80-214-5416- 3.Detail
SZENDIUCH, I. Pouzdření v mikroelektronice. Brno: NOVPRESS s.r.o., 2016. 86 p. ISBN: 978-80-214-5417- 0.Detail
OTÁHAL, A.; SZENDIUCH, I.; ŠIMEK, V.; CRHA, A.; RŮŽIČKA, R. Inovace procesu pokovení průchozích otvorů v DPS. DPS Elektronika od A do Z, 2016, no. 1/ 2016, p. 2-3. ISSN: 1805-5044.Detail
SKÁCEL, J.; OTÁHAL, A.; SZENDIUCH, I. Designing of infrared heater with homogenous heat transfer. In Proceedings of the International Spring Seminar on Electronics Technology, 39th International Spring Seminar on Electronics Technology, ISSE 2016. International Spring Seminar on Electronics Technology ISSE. Volume 2016- September. Pilsen, Czech Republic: IEEE, 345 E 47TH ST, NEW YORK, NY 10017 USA, 2016. p. 62-65. ISBN: 978-1-5090-1389- 0. ISSN: 2161-2536.Detail | WWW
SKÁCEL, J.; OTÁHAL, A.; SZENDIUCH, I. Sensitive Analysis of IR Heat Emitter for Soldering. In Proceedings of the 22nd Conference STUDENT EEICT 2016. Brno: Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií, 2016. p. 655-659. ISBN: 978-80-214-5350- 0.Detail
SKÁCEL, J.; OTÁHAL, A.; ŘIHÁK, P.; SZENDIUCH, I. The Quality of BGA Solder Joint with Underfill. In Sborník IMAPS flash Conference 2016. ElectroScope - http://www.electroscope.zcu. cz. 2016. p. 19-22. ISBN: 978-80-214-5419- 4. ISSN: 1802-4564.Detail
SOMER, J.; URBAN, F.; ČUČKA, M.; URBAN, F.; SZENDIUCH, I. Sensors based on longitudinal fiber Bragg gratings. In 39th International Spring Seminar on Electronics Technology (ISSE). IEEE Conference proceedings. 2016. p. 472-475. ISBN: 978-1-5090-1389-0. ISSN: 2161-2064.Detail
OTÁHAL, A.; CRHA, A.; ŠIMEK, V.; RŮŽIČKA, R.; SZENDIUCH, I. ENHANCED METHOD OF THROUGH-HOLE COPPER PLATING. Proceedings of the 22nd Conference STUDENT EEICT 2016. Brno: Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií, 2016. p. 610-614. ISBN: 978-80-214-5350-0.Detail
OTÁHAL, A.; ŠIMEK, V.; CRHA, A.; RŮŽIČKA, R.; SZENDIUCH, I. Innovative Methods in Activation Process of Through-hole Plating. Periodica Polytechnica-Electrical Engineering, 2016, vol. 60, no. 4, p. 217-222. ISSN: 0324-6000.Detail | WWW
OTÁHAL, A.; ŠIMEK, V.; CRHA, A.; RŮŽIČKA, R.; SZENDIUCH, I. Innovative Methods for Through Holes Plating. In 2016 39th International Spring Seminar on Electronics Technology (ISSE). International Spring Seminar on Electronics Technology ISSE. Pilsen, Czech Republic: University of West Bohemia, 2016. p. 48-52. ISBN: 978-1-5090-1389-0. ISSN: 2161-2536.Detail
SOMER, J.; KLÍMA, M.; MACHÁČ, P.; SZENDIUCH, I. Joining LTCC, Al2O3 and SiC substrates for higher operating temperature applications. In Materials Structure & Micromechanics of Fracture (MSMF8). Solid State Phenomena. 2016. p. 631-634. ISBN: 978-80-214-5357-9. ISSN: 1662-9779.Detail
2015
SZENDIUCH, I.; HEJÁTKOVÁ, E. Innovation in Microelectronics Assembly Innovation in Microelectronics Assembly Innovation in Microelectronics Assembly Technology Education. International Conference on Engineering Education - New Technologies and Innovation for Global Business. 1. Zagreb: MATE Ltd., Zagreb, 2015. p. 451-457. ISBN: 978-953-246-232- 6.Detail
SOMER, J.; ŠTEKOVIČ, M.; URBAN, F.; SZENDIUCH, I. Development of Optical Inclinometer in LTCC Technology. In Novel Trends in Electronics Manufacturing - Book of Abtracts 38th International Spring Seminar on Electronics Technology. Hungary: Budapest University of Technology and Economics, 2015. p. 482-486. ISBN: 978-963-313-177-0.Detail | WWW
SZENDIUCH, I. IMAPS a pokrokové technologie v mikroelektronických montážích. DPS Elektronika od A do Z. Liberec: DPS od A do Z, 2015. p. 1-24. Detail
SZENDIUCH, I.; SOMER, J.; VALA, R.; ADÁMEK, M.; BURŠÍK, M.; HEJÁTKOVÁ, E.; OTÁHAL, A.; PSOTA, B.; ŘEZNÍČEK, M.; ŘIHÁK, P.; SKÁCEL, J. Moderní mikroelektronické technologie - základ elektronického hardware. 1. 1. Brno: Vysoké učení technické v Brně, FEKT, 2015. 188 p. ISBN: 978-80-214-5293- 0.Detail
SZENDIUCH, I.; OTÁHAL, A.; PSOTA, B. Optimalizace modelu vícevrstvé DPS při mechanickém testování. DPS Elektronika od A do Z, 2015, vol. 1, no. 6, p. 4-5. ISSN: 1805- 5044.Detail | WWW
SZENDIUCH, I.; OTÁHAL, A.; PSOTA, B. Mechanické testování elektronických sestav. In Mechanické testování elektronických sestav. 1. Brno: Novpress Brno, 2015. p. 1-26. ISBN: 978-80-214-5271- 8.Detail
OTÁHAL, A.; PSOTA, B.; SZENDIUCH, I. The Vibration Testing as Tool for Optimizing of Two PCB Connection. In Novel Trends in Electronics Manufacturing - Book of Abtracts 38th International Spring Seminar on Electronics Technology. 2015. p. 339-342. ISBN: 978-963-313-177-0.Detail | WWW
ŘIHÁK, P.; VALA, R.; SZENDIUCH, I. Detection of Defects on BGA Solder Balls Using 2D and 3D Methods. In Novel Trends in Electronic Manufacturing - Book of Abstracts 38th International Spring Seminar on Electronics Technology. Hungary: Budapest University of Technology and Economics, 2015. p. 245-249. ISBN: 978-963-313-177-0.Detail | WWW
VALA, R.; ŘIHÁK, P.; SZENDIUCH, I. Influence of Flux throughout Reflow Process on FBGA Solder Balls. In Novel Trends in Electronic Manufacturing - Book of Abstracts 38th International Spring Seminar on Electronics Technology. Hungary: Budapest University of Technology and Economics, 2015. p. 250-254. ISBN: 978-963-313-177-0.Detail | WWW
SOMER, J.; URBAN, F.; URBAN, F.; SZENDIUCH, I. Optical pressure sensors in LTCC technology. Abstracts Proceedings, International flash conference IMAPS - Czech and Slovak chapter. 2015. p. 41-42. ISBN: 978-80-214-5270- 1.Detail
OTÁHAL, A.; SZENDIUCH, I.; ŠIMEK, V.; CRHA, A.; RŮŽIČKA, R. Optimization of Through- hole Plating Method for Prototyping. In Abstracts Proceedings, International flash conference IMAPS - Czech and Slovak chapter. ElectroScope - http://www.electroscope.zcu. cz. 2015. p. 54-56. ISBN: 978-80-214-5270- 1. ISSN: 1802-4564.Detail
OTÁHAL, A.; SZENDIUCH, I.; ŠEFARA, P. MECHANICAL BEHAVIOR OF SMD SOLDER JOINT SOLDERED UNDER NITROGEN ATMOSPHERE. Abstracts Proceedings, International flash conference IMAPS - Czech and Slovak chapter. 2015. p. 45-46. ISBN: 978-80-214-5270- 1.Detail
SKÁCEL, J.; PSOTA, B.; SZENDIUCH, I. COMPARISON OF QFN AND BGA CHARACTERISTICS. In IMAPS FLASH CONFERENCE 2015. 1. BRNO: Vysoké účení technické v Brně, 2015. p. 25-26. ISBN: 978-80-214-5270- 1.Detail
SKÁCEL, J.; SZENDIUCH, I. THERMOMECHANICAL SIMULATION OF MODERN, ELECTRONIC PACKAGES. In Proceedings of the 21st Conference STUDENT EEICT 2015. Brno: Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních, 2015. p. 289-291. ISBN: 978-80-214-5148- 3.Detail | WWW
PSOTA, B.; SZENDIUCH, I.; OTÁHAL, A. Influence of the PCB Attachment on the Mechanical Properties in Modal Analysis. In Proceedings on 20th European Microelectronics and Packaging Conference & Exhibition. 2015. p. 1-4. ISBN: 978-0-9568086-1-5.Detail | WWW
BURŠÍK, M.; JANKOVSKÝ, J.; ŘEZNÍČEK, M.; SZENDIUCH, I.; SITKO, V. Innovative procedures for the evaluation method of the efficiency in the cleaning process. In Electronics Technology (ISSE), 2015 38th International Spring Seminar. Eger, Hungary: IEEE, 2015. p. 288-291. ISBN: 978-963-313-177-0.Detail | WWW
PSOTA, B.; OTÁHAL, A.; SZENDIUCH, I. Optimalizace návrhu DPS při testování vibracemi. 2015. p. 1-31. Detail
PSOTA, B.; OTÁHAL, A.; SZENDIUCH, I. Influence of the cavities on the PCB mechanical properties. CIRCUIT WORLD, 2015, vol. 41, no. 2, p. 1-6. ISSN: 0305-6120.Detail
SOMER, J.; ŠTEKOVIČ, M.; URBAN, F.; ŠANDERA, J.; SZENDIUCH, I. Bonding of zero-shrink LTCC with alumina ceramics. SOLDERING & SURFACE MOUNT TECHNOLOGY, 2015, vol. 27, no. 4, p. 157-163. ISSN: 0954-0911.Detail | WWW
SZENDIUCH, I.; HEJÁTKOVÁ, E.; OTÁHAL, A.; PSOTA, B. Some Insights to Quality Improvement in Engineering Education System. International Conference on Engineering Education - New Technologies and Innovation for Global Business. 1. Zagreb: MATE Ltd., Zagreb, 2015. p. 25-31. ISBN: 978-953-246-232- 6.Detail
2014
SZENDIUCH, I.; PSOTA, B. Simulace tepelných vlastností pouzder QFN a BGA. Slaboproudý obzor, 2014, vol. 70, no. 1, p. 2-6. ISSN: 0037- 668X.Detail
BURŠÍK, M.; JANKOVSKÝ, J.; ŘEZNÍČEK, M.; SZENDIUCH, I. Analytic method for monitoring of cleaning process efficiency. In IEEE CONFERENCE PUBLICATIONS. Dresden, Německo: IEEE, 2014. p. 341-344. ISBN: 978-3-934142-49-7.Detail
SZENDIUCH, I. Der Einfluss des Stickstoff auf Reflowloten. Mallorca: TBB Technologie Beratung Bell, 2014. p. 88-93. Detail
SZENDIUCH, I.; PSOTA, B.; OTÁHAL, A. Nové směry v konstrukci plošných spojů a mechanické testování. DPS Elektronika od A do Z, 2014, vol. 5., no. 1, p. 12-15. ISSN: 1805-5044.Detail
SZENDIUCH, I.; OTÁHAL, A.; PSOTA, B.; KLAPKA, M. Vibration Testing as a Tool to Optimize the Configuration of the PCBs. In IMAPS Proceedings. 1. San Diego, USA: IMAPS, 2014. p. 50-54. ISBN: 978-0-9909028-0- 5.Detail
SZENDIUCH, I. Distribution of Free–Field Photovoltaic Plants in Europe and Exemplarily in South Moravia, Czech Republic. In 37th Int. Spring Seminar on Electronics Technology. 1. Drážďany, Německo: IEEE, 2014. p. 350-354. ISBN: 978-1-4799-4455-2.Detail
SZENDIUCH, I. Technická podpora univerzity – cesta k inovaci součástek a obvodů v průmyslu. 1. Brno: odborný časopis pro vývoj a výrobu elektroniky, 2014. p. 1-5. ISBN: 978-80-214-5293- 0.Detail
SZENDIUCH, I.; HEJÁTKOVÁ, E.; ŘIHÁK, P. Innovation in Electric Engineering Education through the Introduction of the Hybrid Integration in the Experimental Lessons. In ICEE/ ICIT 2014. 1. Riga: iNNER, 2014. p. 332-238. ISBN: 9781479931927.Detail
PSOTA, B.; OTÁHAL, A.; SZENDIUCH, I. INFLUENCE OF THE CAVITIES ON THE PCB MECHANICAL PROPERTIES. In Electronic Devices and Systems, IMAPS CS International Conference 2014. Brno: Vysoké učení technické v Brně, 2014. p. 1-7. ISBN: 978-80-214-4985- 5.Detail
KLÍMA, M.; SOMER, J.; BLAHOVÁ, L.; PROCHÁZKA, M.; SZENDIUCH, I. Usage of Low-Temperature Co- Fired Ceramic In Hermetic Packaging. Advances in Electronic System Integration - Book of Abtracts 37th International Spring Seminar on Electronics Technology. 2014. p. 99-103. ISBN: 978-3-934142-49- 7.Detail
OTÁHAL, A.; ADÁMEK, M.; SZENDIUCH, I. Impact of solder paste drying on the solderability. In 37th Int. Spring Seminar on Electronics Technology. Dresden: IEEE, 2014. p. 198-201. ISBN: 978-1-4799-4455-2.Detail
OTÁHAL, A.; SZENDIUCH, I.; PSOTA, B. Mechanical testing of PCB using computer simulations. In 37th Int. Spring Seminar on Electronics Technology. Dresden: IEEE, 2014. p. 290-293. ISBN: 978-1-4799-4455-2.Detail
SOMER, J.; ŠTEKOVIČ, M.; ŠANDERA, J.; SZENDIUCH, I. Bonding of LTCC with Alumina ceramics. In Electronic Devices and Systems, IMAPS CS International Conference 2014. Brno: Vysoké učení technické v Brně, 2014. p. 60-64. ISBN: 978-80-214-4985- 5.Detail
FRANTÍK, O.; ČECH, P.; PORUBA, A.; BAŘINKA, R.; STOJAN, R.; SZENDIUCH, I. Vývoj emitoru dotovaného fosforem pro levnější a účinnější krystalické křemíkové solární články. ElectroScope - http://www.electroscope.zcu. cz, 2014, vol. 2014, no. 1, p. 06-08. ISSN: 1802- 4564.Detail
SZENDIUCH, I.; HEJÁTKOVÁ, E.; PSOTA, B.; OTÁHAL, A. EU Research programs - the Way to the Quality Increase of PhD Study. In ICEE/ ICIT 2014. 1. Riga: iNNER, 2014. p. 26-31. ISBN: 9781479931927.Detail
2013
SZENDIUCH, I.; PSOTA, B.; OTÁHAL, A.; HEJÁTKOVÁ, E. Board on Board New PCB Configuration Moving in 3D Packaging. In THE INTERNATIONAL CONFERENCE - EDS, Brno 26 - 27 June 2013. Vysoké učení technické v Brně: Novapress sro, 2013. p. 224-227. ISBN: 978-80-214-4754- 7.Detail
PSOTA, B.; BURŠÍK, M.; SZENDIUCH, I. The Use of Computer Simulation in the Electronic Packaging Process. Key Engineering Materials (print), 2013, vol. 2014, no. 592- 593, p. 201-204. ISSN: 1013- 9826.Detail
SZENDIUCH, I.; PSOTA, B.; OTÁHAL, A. Metodiky mechanického testování elektronických sestav. 2013.Detail
SZENDIUCH, I.; KLAPKA, M.; PSOTA, B.; OTÁHAL, A. Importance of Vibration Testing for New Technological Solutions. In Proceedings EMPC 2013. 1. Grenoble: IMAPS France, 2013. p. 144-148. ISBN: 978-2-9527467-1- 7.Detail
OTÁHAL, A.; SZENDIUCH, I. Study of Atmosphere Influence on BGA Solder Balls Process. Electronics Technology (ISSE), 2011 34th International Spring Seminar on Electronics, 2013, vol. 36, no. 2013, p. 121-126. ISSN: 2161- 2528.Detail
PSOTA, B.; KLÍMA, M.; NICÁK, M.; SZENDIUCH, I. Usage of LTCC Technology in Electronic Packaging. Electronics Technology (ISSE), 2011 34th International Spring Seminar on Electronics, 2013, vol. 36, no. 2013, p. 206-209. ISSN: 2161- 2528.Detail
PULEC, J.; SZENDIUCH, I. Planární filtr v tlustovrtvové technologii. Slaboproudý obzor, 2013, vol. 69, no. 3, p. 10-14. ISSN: 0037- 668X.Detail
PSOTA, B.; BURŠÍK, M.; SZENDIUCH, I. The Use of Computer Simulation in the Electronic Packaging Process. Materials Structure & Micromechanics of Fracture. Brno, Česká republika: 2013. p. 182-182. ISBN: 978-80-214-4739- 4.Detail
BURŠÍK, M.; SZENDIUCH, I.; JANKOVSKÝ, J.; ŘEZNÍČEK, M. Optimizing of PCBA cleaning process through process calibration tools. In EMPC 2013. 2013. Grenoble. France: IEEE, 2013. p. 1-3. ISBN: 978-2-9527467-1- 7.Detail | WWW
BURŠÍK, M.; SZENDIUCH, I.; JANKOVSKÝ, J.; ŘEZNÍČEK, M. New method for deposition of thixotropic materials with resolution under 100 um. In EMPC 2013. 2013. Grenoble. France: IEEE, 2013. p. 1-3. ISBN: 978-2-9527467-1- 7.Detail | WWW
BURŠÍK, M.; JANKOVSKÝ, J.; ŘEZNÍČEK, M.; SZENDIUCH, I. New method for adjustment of elevation of the ceramic flatness for direct deposition. Electronics Technology (ISSE), 2011 34th International Spring Seminar on Electronics, 2013, vol. 2013, no. 36, p. 6-7. ISSN: 2161- 2528.Detail | WWW
KLÍMA, M.; PSOTA, B.; SZENDIUCH, I. Compatibility of through-hole technology devices with low-temperature co- fired ceramic substrate. Electronics Technology (ISSE), 2011 34th International Spring Seminar on Electronics, 2013, vol. 36, no. 2013, p. 127-131. ISSN: 2161- 2528.Detail
KLÍMA, M.; SZENDIUCH, I.; SOMER, J.; PROCHÁZKA, M. Hermetic Properties Of Low-Temperature Co- Fired Ceramic Applications. In Sborník příspěvků Mezinárodní Masarykovy konference pro doktorandy a mladé vědecké pracovníky 2013. Hradec Králové: MAGNANIMITAS, 2013. p. 1-8. ISBN: 978-80-87952-00- 9.Detail
OTÁHAL, A.; ADÁMEK, M.; JANSA, V.; SZENDIUCH, I. Investigation of the Mechanical Properties of Lead- Free Solder Materials. Key Engineering Materials (web), 2013, vol. 2013, no. 592- 593, p. 453-456. ISSN: 1662- 9795.Detail | WWW
PULEC, J.; SZENDIUCH, I. Frequency bandpass filter in hybrid thick film technology. ElectroScope - http://www.electroscope.zcu. cz, 2013, vol. 2012, no. VI., p. 1-4. ISSN: 1802- 4564.Detail
KLÍMA, M.; PSOTA, B.; SZENDIUCH, I. Wire-Bonds Durability in High- Temperature Applications. In Electronic Devices and Systems - IMAPS CS International Conference 2013. first. Brno: VUT, 2013. p. 38-43. ISBN: 978-80-214-4754- 7.Detail
KLÍMA, M.; HOLÍK, M.; SVATOŠ, V.; HUBÁLEK, J.; SZENDIUCH, I.; URBAN, F. Photo-reflective layer on Low Temperature Co- fired Ceramic for optical applications. Key Engineering Materials (print), 2013, vol. 592- 593, no. 1, p. 457-460. ISSN: 1013- 9826.Detail
KLÍMA, M.; PSOTA, B.; SZENDIUCH, I. Wire-Bonds Durability in High- Temperature Applications. ElectroScope - http://www.electroscope.zcu. cz, 2013, vol. 2013, no. 5, p. 7-11. ISSN: 1802- 4564.Detail
SZENDIUCH, I.; PULEC, J. Planární filtr v tlustovrstvové tehnologii. Slaboproudý obzor, 2013, vol. 69, no. 3, p. 10-14. ISSN: 0037- 668X.Detail
2012
SZENDIUCH, I.; BURŠÍK, M.; ŘEZNÍČEK, M.; HEJÁTKOVÁ, E. THE SUBJECT "ELECTRONICS HARDWARE" AS INTERDISCIPLINARY TOPIC FOR THE ELECTRIC ENGINEERING EDUCATION. In International Conference Educon 2012. EDUCON 2012. 1. Marakesh: IEEE, 2012. p. 74-79. ISBN: 978-1-4673-1455- 8. ISSN: 2165- 9559.Detail
SZENDIUCH, I.; BURŠÍK, M.; JANKOVSKÝ, J. The dispensing system with the support of ultrasonic energy. In Proceedings of 4th ESTC 2012. 1. Amsterdam: Medicongress, 2012. p. 131-134. ISBN: 978-1-4673-4644-3.Detail
PSOTA, B.; SZENDIUCH, I. The Increasing Importance of The Thermal Management for Modern Electronic Packages. In Electronics Devices and systems 2012. 1. Tabor 43a, 612 00 Brno: Ing. Vladislav Novotný - Litera, 2012. p. 189-196. ISBN: 978-80-214-4539- 0.Detail
SCHNEDERLE, P.; ADÁMEK, M.; SZENDIUCH, I. Effect of nitrogen atmosphere on the soldering process for different types of lead- free solders. In 35th International Spring Seminar on Electronics Technology - ISSE 2012 Proceedings. Electronics Technology (ISSE), 2011 34th International Spring Seminar on Electronics. 1. Gusshausstrasse 27- 29, A-1040 WIEN - Austria: IEEE Xplore digital library: Vienna University of Technology, 2012. p. 201-206. ISBN: 978-1-4673-2241- 6. ISSN: 2161- 2528.Detail | WWW
SCHNEDERLE, P.; ADÁMEK, M.; SZENDIUCH, I. Effect of nitrogen atmosphere on the quality of lead- free solder joints. In EDS 12 IMAPS CS INTERNATIONAL CONFERENCE PROCEEDINGS. 1. Brno: Ing. Vladislav Pokorný - LITERA, Tábor 43a, 612 00 Brno, 2012. p. 308-313. ISBN: 978-80-214-4539- 0.Detail
ADÁMEK, M.; ŠTEKOVIČ, M.; SZENDIUCH, I. Thick Film 3- D Electrode Configuration for Electrochemical Applications. In 4TH ELECTRONICS SYSTEM INTEGRATION TECHNOLOGIES CONFERENCE ESTC 2012. 1. Amsterdam: Medicongress, Kloosterstraat 5, B-9960 Assenede, Belgium, 2012. p. 1-6. ISBN: 978-1-4673-4644- 3.Detail | WWW
PSOTA, B.; SZENDIUCH, I. The Increasing Importance of the Thermal Management for Modern Electronic Packages. ElectroScope - http://www.electroscope.zcu. cz, 2012, vol. 2012, no. VI., p. 1-5. ISSN: 1802- 4564.Detail
KLÍMA, M.; SZENDIUCH, I. Possibilities of making 3D resistors in LTCC technology. In Electronics Technology (ISSE), 2012 35th International Spring Seminar on Electronics Technology. 2012. p. 50-54. ISBN: 978-1-4673-2240- 9.Detail
PSOTA, B.; SZENDIUCH, I.; BURŠÍK, M. Optimization of Wire Loop Formation in Wirebonding Process Using Computer Simulation. In 2012 35th International Spring Seminar on Electronics Technology (ISSE). Electronics Technology (ISSE), 2011 34th International Spring Seminar on Electronics. Vienna University of Technology, Gusshausstrasse 27- 29, A-1040 WIEN - Austria: IEEE Xplore digital library, 2012. p. 282-285. ISBN: 978-1-4673-2241- 6. ISSN: 2161- 2528.Detail | WWW
PULEC, J.; SZENDIUCH, I. Planar Thick Film Frequency Filter Design. In 2012 35th International Spring Seminar on Electronics Technology (ISSE). Electronics Technology (ISSE), 2011 34th International Spring Seminar on Electronics. Vienna University of Technology, Gusshausstrasse 27- 29, A-1040 WIEN - Austria: IEEE Xplore digital library, 2012. p. 485-487. ISBN: 978-1-4673-2241- 6. ISSN: 2161- 2528.Detail | WWW
ADÁMEK, M.; SCHNEDERLE, P.; SZENDIUCH, I.; LIPAVSKÝ, L. The Properties Comparison of Solder Joints on Ceramic and FR- 4 Substrates. In 4TH ELECTRONICS SYSTEM INTEGRATION TECHNOLOGIES CONFERENCE ESTC 2012. 1. Amsterdam, NL: Medicongress, Kloosterstraat 5, B-9960 Assenede, Belgium, 2012. p. 1-5. ISBN: 978-1-4673-4644- 3.Detail | WWW
KLÍMA, M.; SZENDIUCH, I. Thermodynamic Sensor of Thermal Radiation. In Proceedings of the 18th conference Volume 3. Brno: LITERA Brno, 2012. p. 324-328. ISBN: 978-80-214-4462- 1.Detail
2011
SZENDIUCH, I. Necessity for Teaching of Eco- Design in Electric Engineering Education. In tronic Technology33rd International Spring Seminar on Electronic Technology. 1. Warszava. Poland: IEEE Xplore digital library, 2011. p. 58-59. ISBN: 978-1-4244-7849- 1.Detail
PSOTA, B.; SZENDIUCH, I. Úvod do výuky modelování elektronických systémů simulačním programem ANSYS. In MIKROSYN. Nové trendy v mikroelektronických systémech a nanotechnologiích. 2011. p. 34-39. ISBN: 978-80-214-4405- 8.Detail
SZENDIUCH, I. Development in Electronic Packaging - Moving to 3D System Configuration. Radioengineering, 2011, vol. April 2011, no. 1, p. 214-220. ISSN: 1210- 2512.Detail
SZENDIUCH, I.; PSOTA, B.; HEJÁTKOVÁ, E. Innovation and Creativity in Electric Engineering Education - In the Past and Today. International Conference on Engineering Education and Research "Progress Through Partnership", 2011, vol. 2011, no. 1, p. 51-55. ISSN: 1562- 3580.Detail
PULEC, J.; SZENDIUCH, I. Nové aspekty v pouzdření moderních mikroelektronických systémů. In MIKROSYN. Nové trendy v mikroelektronických systémech a nanotechnologiích. (id 15937). 1. BRNO: NOVPRESS, 2011. p. 1-5. ISBN: 978-80-214-4229- 0.Detail
PSOTA, B.; SZENDIUCH, I. Využití počítačových simulací pro pouzdření v mikroelektronice. In MIKROSYN. Nové trendy v mikroelektonických systémech a nanotechnologiích. (id 15937). 1. Brno 2010: NOVPRESS, 2011. p. 49-61. ISBN: 978-80-214-4229- 0.Detail
PULEC, J.; SZENDIUCH, I. Příspěvek k problematice termomechanického namáhání v mikroelektronických strukturách. In MIKROSYN. Nové trendy v mikroelektronických systémech a nanotechnologiích. (id 15937). 1. BRNO: NOVPRESS, 2011. p. 19-24. ISBN: 978-80-214-4229- 0.Detail
NICÁK, M.; ŠVECOVÁ, O.; ŠANDERA, J.; PULEC, J.; SZENDIUCH, I. Reliability and Simulation of Lead- Free Solder Joint Behavior in 3D Packaging Structure. In Key Engineering Materials Vol. 465 (2011). Key Engineering Materials (print). Švýcarsko: Trans Tech Publications, 2011. p. 491-494. ISBN: 978-3-03785-006- 0. ISSN: 1013-9826.Detail | WWW
PSOTA, B.; SZENDIUCH, I. Modeling of Microelectronic Structures and Packages using ANSYS Software. 2011. ISBN: 978-1-4577-2111- 3.Detail
BURŠÍK, M.; SZENDIUCH, I.; HEJÁTKOVÁ, E. Třetí část hybridních integrovaných obvodů - Výukový proces v mikroelektronických technologiích. ISSE 2011 - PROCEEDINGS. 1. Košice, Slovensko: Technická Univerzita Košice, 2011. p. 632-636. ISBN: 978-1-4577-2111- 3.Detail | WWW
KLÍMA, M.; SZENDIUCH, I. Návrh 3D struktur realizovaných na LTCC substrátech pomocí programu HYDE. In MIKROSYN. Nové trendy v mikroelektronických systémech a nanotechnologiích. Brno: Novapress, 2011. p. 63-68. ISBN: 978-80-214-4405- 8.Detail
PULEC, J.; SZENDIUCH, I. Thick Film Planar Inductor Characterization. In Proceedings of 18th European microelectronics packaging conference EMPC 2011. Brighton, UK: IMAPS- Europe, 2011. p. 458-461. ISBN: 978-0-9568086-0- 8.Detail | WWW
BURŠÍK, M.; SZENDIUCH, I.; JANKOVSKÝ, J. Dispensing process with additional ultrasonic energy. In Proceedings of 18th European microelectronics packaging conference EMPC 2011. Brighton, UK: IMAPS- Europe, 2011. p. 476-479. ISBN: 978-0-9568086-0- 8.Detail | WWW
BURŠÍK, M.; SZENDIUCH, I.; ŘEZNÍČEK, M.; JANKOVSKÝ, J. Moderní laboratoř mikroelektronických technologií. DPS - Plošné spoje od A do Z, 2011, vol. 2011, no. 1, p. 61-62. ISSN: 1804- 4891.Detail
PULEC, J.; SZENDIUCH, I. Contribution to characterization of interdigital capacitors. In ISSE 2011 Conference Proceedings. 2011. p. 50-52. ISBN: 978-1-4577-2111- 3.Detail
ŠVECOVÁ, O.; ŠANDERA, J.; KOSINA, P.; SZENDIUCH, I. Reliability Model for Assessment of Lifetime of Lead- Free Solder Joints. In 18th European microelectronics packaging conference EMPC 2011 - Proceedings. 1. Brihton, UK: 2011. p. 210-214. ISBN: 978-0-9568086-0- 8.Detail
ADÁMEK, M.; SCHNEDERLE, P.; SZENDIUCH, I. Zařízení pro zkoumání vlivu dusíkové atmosféry u bezolovnatého pájenís minimální spotřebou dusíku. In MIKROSYN. Nové trendy v mikroelektronických systémech a nanotechnologiích. Výzkumný záměr Ministerstva školství, mládeže a tělovýchovy MSM 0021630503. Seminář o výsledcích výzkumného záměru v roce 2011. Sborník příspěvků. NOVPRESS s.r.o., Brno: No, 2011. p. 1-5. ISBN: 978-80-214-4405- 8.Detail
SZENDIUCH, I.; HEJÁTKOVÁ, E.; ŘEZNÍČEK, M.; PSOTA, B. Electronics Hardware Interdisciplinary Subject for the Engineering Study Programs. International Conference on Engineering Education and Research "Progress Through Partnership", 2011, vol. 2011, no. 1, p. 46-50. ISSN: 1562- 3580.Detail
2010
SZENDIUCH, I.; HEJÁTKOVÁ, E. Increasing Importance of Electronic Hardware Education for Electrical Engineers. In EQ- 2010. 1. Izhevsk, Rusko: Izhevsk Publishing Home, 2010. p. 411-417. ISBN: 978-5-7526-0442- 3.Detail
NICÁK, M.; SZENDIUCH, I. CONTRIBUTION TO LEAD- FREE SOLDERED 3D STRUCTURES. In Second Forum of Young Researchers. In the framework of International Forum "Education Quality - 2010" : Proceedings. Izhevsk, Russia: Publishing House of ISTU, 2010. p. 378-382. ISBN: 978-5-7526-0442- 3.Detail
SZENDIUCH, I.; NICÁK, M. On the Application of Solder Balls for 3D Packaging. PLUS, 2010, vol. 2010, no. 8, p. 1855-1860. ISSN: 1436- 7505.Detail
SZENDIUCH, I. Pouzdření polovodičových čipů - základ moderního hardware. Sdělovací technika, 2010, vol. 2010, no. 11, p. 10-14. ISSN: 0036- 9942.Detail
PULEC, J.; SZENDIUCH, I. Modeling of Current Density in Thick Film Resistors. In STUDENT EEICT 2010. Brno: NOVPRESS, 2010. p. 236-240. ISBN: 978-80-214-4079- 1.Detail
NICÁK, M.; SZENDIUCH, I. Contribution to realization of 3D structures. Abstract proceedings. Polymer Electronics and Nanotechnologies: towards System Integration. Warsaw, Poland: Oficyna Wydawnicza Politechniki Warszawskiej, 2010. p. 110-111. ISBN: 978-83-7207-870- 4.Detail
PULEC, J.; SZENDIUCH, I. Contribution to modeling of stressing in microelectronic structures. In ISSE 2008 Conference Proceedings. 2010. p. 383-385. ISBN: 978-1-4244-7849- 1.Detail
NICÁK, M.; ŠANDERA, J.; SZENDIUCH, I. Contribution to realization of 3D structures. In 33rd International Spring Seminar on Electronics Technology (ISSE), 2010. Warsaw, Poland: IEEE Xplore digital library, 2010. p. 156-159. ISBN: 978-1-4244-7849- 1.Detail | WWW
PULEC, J.; SZENDIUCH, I. Analýza vlivu pouzdření na izolační vlastnosti. Slaboproudý obzor, 2010, vol. 67, no. 2, p. 12-16. ISSN: 0037- 668X.Detail
BURŠÍK, M.; NOVOTNÝ, M.; JANKOVSKÝ, J.; HEJÁTKOVÁ, E.; SZENDIUCH, I. Testing and Simulation of Wire Bonding Attach for higher Current. In Electronics System Integration Technology Conference ESTC 2010 in Berlin. 1. Berlín, Německo: 2010. p. 1-4. ISBN: 978-1-4244-8555- 0.Detail
BURŠÍK, M.; SZENDIUCH, I.; JANKOVSKÝ, J.; HEJÁTKOVÁ, E. New Facts from Lead- free Solders Reliability Investigation. In Electronics System Integration Technology Conference ESTC 2010 in Berlin. 1. Berlín, Německo: 2010. p. 101-105. ISBN: 978-1-4244-8555- 0.Detail
PULEC, J.; SZENDIUCH, I. Contribution to modeling of stressing in microelectronic structures. Abstract proceedings. Polymer Electronics and Nanotechnologies: towards System Integration. Warsaw, Poland: Oficyna Wydawnicza Politechniki Warszawskiej, 2010. p. 218-219. ISBN: 978-83-7207-870- 4.Detail
ŘEZNÍČEK, M.; SZENDIUCH, I. Thermodynamic Sensors New Opportunities for Measuring and Control in Industrial Applications. In Electronics System Integration Technology Conference ESTC 2010 in Berlin. 1. Berlin, Německo: 2010. p. 1-5. ISBN: 978-1-4244-8555- 0.Detail
NICÁK, M.; SZENDIUCH, I. Použití pájecích kuliček v 3D pouzdření. In Mikrosyn. Nové trendy v mikroelektonických systémech a nanotechnologiích. 1. Brno: Novpress, 2010. p. 11-19. ISBN: 978-80-214-4229- 0.Detail
NICÁK, M.; ŠVECOVÁ, O.; PULEC, J.; ŠANDERA, J.; SZENDIUCH, I. Reliability and Simulation of Lead- free Solder Joint Behavior in 3D Packaging Structures. 6th International Conference on Materials Structure & Micromechanics of Fracture - MSMF6 - Abstract booklet. 1. Brno: VUT Brno, FSI & Repropress, Srbská 53, Brno, 2010. p. 184-184. ISBN: 978-80-214-4112- 5.Detail
SZENDIUCH, I.; PULEC, J. Nové aspekty v pouzdření moderních elektronických systémů. In MIKROSYN. Nové trendy v mikroelektronických systémech a nanotechnologiích. 1. Brno: Novpress, 2010. p. 25-32. ISBN: 978-80-214-4229- 0.Detail
2009
SZENDIUCH, I. Technology of modern soldering. In EDS 2009. Brno, Czech republic: EDS Czech republic, 2009. p. 102-108. ISBN: 978-80-214-3933- 7.Detail
SZENDIUCH, I. Innovation in micro electronics technology education. In EDS 2009. 1. Brno, Czech Republic: EDS Czech republic, 2009. p. 90-97. ISBN: 978-80-214-3933- 7.Detail
ŘEZNÍČEK, M.; SZENDIUCH, I.; ŘEZNÍČEK, Z. Bisected Thermodynamic Sensor as the Power AC/ DC Transmitter. In EMPC2009 17th European Microelectronics and Packaging Conference & Exhibition. Rimini: 2009. p. 33-38. ISBN: 978-1-4244-4722- 0.Detail
ŘEZNÍČEK, M.; SZENDIUCH, I.; ŘEZNÍČEK, Z. Segmented Thermodynamic Sensor in Applications. In 32nd International Spring Seminar on Electronics Technology Abstract Proceedings. 1. Brno: 2009. p. 56-60. ISBN: 978-1-4244-4260- 7.Detail
BURŠÍK, M.; SZENDIUCH, I. Evaluation of Cleaning in Electronic Production. In ISSE 2009 32nd International Spring Seminar on Electronics Technology, Abstracts Proceedings. 1. Brno, Czech Republic: 2009. p. 60-64. ISBN: 978-1-4244-4260- 7.Detail
2008
SZENDIUCH, I.; BURŠÍK, M. Optimalizace účinnosti čistících zařízení pro elektroniku. Electronic Engineering Magazine, 2008, vol. 2008, no. 2, p. 32-35. ISSN: 1802- 520X.Detail
BURŠÍK, M.; SZENDIUCH, I. Some remarks to the effectiveness of cleaning in electronics. In ESTC 2008 2nd Electronics System-Integration Technology Conference 1st - 4th September 2008, Greenwich, London, UK. Greenwich, London, Anglie: 2008. p. 1339-1343. ISBN: 978-1-4244-2813- 7.Detail
ŘEZNÍČEK, M.; SZENDIUCH, I.; BURŠÍK, M.; ŘEZNÍČEK, Z.; HEJÁTKOVÁ, E. Termodynamická senzorika - Nový pohled na monitorování termodynamických systémů - část 2. 1. Brno: NOVPRESS s.r.o., 2008. p. 1-17. Detail
ŘEZNÍČEK, M.; SZENDIUCH, I.; ŘEZNÍČEK, Z. Thick Film Double Thermodynamic Sensor System. In ESTC 2008 2nd Electronics System-Integration Technology Conference 1st-4th September 2008, Greenwich, London, UK. Anglie: 2008. p. 1301-1304. ISBN: 978-1-4244-2813- 7.Detail
PRÁŠEK, J.; ADÁMEK, M.; KŘIVKA, J.; SZENDIUCH, I. Reference Electrodes for Thick- Film Sensors. In ISSE 2008 Conference Proceedings. Budapest, Hungary: 2008. p. 522-525. ISBN: 978-963-06-4915- 5.Detail
ŘEZNÍČEK, M.; SZENDIUCH, I. Thick Film Sensor Based on New Principle of Balanced Process Monitoring. In 32nd International IMAPS- IEEE CPMT Poland Conference. Polsko: Oficyna Wydawnicza Politechniki Warszawskiej, 2008. p. 1-6. ISBN: 978-83-917701-6- 0.Detail
2007
Ivan Szendiuch, Jaroslav Jankovský, Marek Novotný. Perspektivní metody pouzdření polovodičových čipů. In BULETIN ANOTACÍ. Bulletin of SMT/ISHM Int. Conference "New Trends in Microelectronics". Brno: SMT- info konsorcium, 2007. p. 22 ( p.)ISSN: 1211- 6947.Detail
SZENDIUCH, I.; ŘEZNÍČEK, M.; ŘEZNÍČEK, Z. Thick Film Sensor for Temperature Balanced Process Monitoring. In Proceedings IMAPS 2007. San Jose: IMAPS USA, 2007. p. 250-255. ISBN: 0-930815-82- 3.Detail
SZENDIUCH, I. Eco- design as the Tool for Decreasing the Impact of Electronic Technology on Environment. In Proceedings IMAPS 2007. San Jose: IMAPS USA, 2007. p. 250-255. ISBN: 0-930815-82- 3.Detail
SZENDIUCH, I. Curicullum for Lead- free Soldering. In Electronic Devices and Systems EDS 07. Brno: Ing. Zdeněk Novotný, 2007. p. 265-270. ISBN: 978-80-214-3470- 7.Detail
SZENDIUCH, I.; HEJÁTKOVÁ, E. Increasing Importance of Microelectronics Technology Education. In Electronic Devices and Systems EDS 07. Brno: Ing. Zdeněk Novotný, 2007. p. 61-65. ISBN: 978-80-214-3470- 7.Detail
SZENDIUCH, I.; HEJÁTKOVÁ, E. Implementation of Eco- design in the Electronics Industry and Education Process. In Proceedings 31th IMAPS Poland. Rzeszow: Rzeszow University of Technology, 2007. p. 473-478. ISBN: 978-83-917701-4- 6.Detail
SZENDIUCH, I.; HEJÁTKOVÁ, E.; VANĚK, J. Some new Aspects in Microelectronics Technology Education. In Proceedings IMAPS Poland 07. Rzeszow: Rzeszow Technical University, 2007. p. 483-486. ISBN: 978-83-917701-4- 6.Detail
SZENDIUCH, I.; VAŠKO, C. Multidisciplinary Aspects in Micro(Nano) electronics Technology Education. In Proceedings of the ICEE 2007. Coimbra: FCTUC, 2007. p. 144-149. ISBN: 978-972-8055-14- 1.Detail
SZENDIUCH, I. Roadmap of Lead- free Soldering. In Proceedings ISSE 2007. 1. Cluj- Napoca: TU Dresden, 2007. p. 55-60. ISBN: 978-973-713-174- 4.Detail
SZENDIUCH, I.; HEJÁTKOVÁ, E.; NOVOTNÝ, M. Effect of Lead- free Conductive Thick Film Materials on Ultrasonic Wire Bondability. In Proceedings ISSE 2007. Cluj- Napoca: TU Dresden, 2007. p. 124-129. Detail
SZENDIUCH, I. 3D - perspektivní způsob pouzdření. In Sborník výzkumného záměru. Brno: 2007. p. 30-33. ISBN: 978-80-214-3534- 6.Detail
SZENDIUCH, I.; NOVOTNÝ, M.; BARTOŇ, Z. Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Interconnections. In Proceedings IDT' 07. Cairo: 2007. p. 242-245. ISBN: 978-1-4244-1824- 4.Detail
SZENDIUCH, I. Vliv tvaru pájecích plošek na jakost pájeného spoje. In Sborník Výzkumného záměru. Brno: 2007. p. 104-107. ISBN: 978-80-214-3534- 6.Detail
NOVOTNÝ, M.; SZENDIUCH, I. Lead- Free Solder Joint Quality Investigation. Acta Electrotechnica et Informatica, 2007, vol. 6, no. 4, p. 18 ( p.)ISSN: 1335- 8243.Detail
NOVOTNÝ, M.; SZENDIUCH, I. Chip Power Interconnection. In Proceeding of 30th International Spring Seminar on Electronics Technology. Napoca: TU of Cluj Napoca, 2007. p. 183 ( p.)ISBN: 1-4244-1218- 8.Detail
VANĚK, J.; HLADÍK, J.; SZENDIUCH, I. Optimization of Properties of Planar Spiral Inductors. In 30th ISSE 2007 Conference Proceedings Emerging Technologies for Electronics Packaging. 1. Cluj-Napoca, Romania: Editura Mediamira, 2007. p. 235-238. ISBN: 1-4244-1218- 8.Detail
VANĚK, J.; HLADÍK, J.; SZENDIUCH, I. Optimization of Propertief of Planar Spiral Inductors. In ISSE 2007 International Spring Seminar on Electronics Technology. Cluj-Napoca, Romania: Editura Mediamira, 2007. p. 120-122. ISBN: 978-973-713-174- 4.Detail
VAŠKO, C.; NOVOTNÝ, M.; SZENDIUCH, I. Virtual laboratory of microelectronic technologies. In Proceedings ISSE 2007, the 30th International Spring Seminar on Electronics Technology. Rumunsko: 2007. p. 114-117. ISBN: 1-4244-1218- 8.Detail
HLADÍK, J.; SZENDIUCH, I.; VANĚK, J.; BAŘINKA, R. Characterization of solar cells contacts deposited by direct writing approach. In 30th ISSE 2007 Conference Proceedings Emerging Technologies for Electronics Packaging. 1. Cluj-Napoca, Romania: Technical University of Cluj- Napoca, 2007. p. 122-123. ISBN: 1-4244-1218- 8.Detail
VAŠKO, C.; SZENDIUCH, I. Eco- design workflow process. In Proceeding EMPC 2007. Finsko: IMAPS Nordic, 2007. p. 459-462. ISBN: 978-952-99751-2- 9.Detail
VAŠKO, C.; NOVOTNÝ, M.; SZENDIUCH, I. Virtual laboratory of microelectronic technologies. In International Conference on Engineering and Education 2007 Proceeding. Portugalsko: University of Coimbra, 2007. p. 485-489. Detail
NOVOTNÝ, M.; SZENDIUCH, I. Methods of Chip Interconnection. In Electronics Devices and Systems 07 Proceedings. Brno: Ing. Zdeněk Novotný CSc., 2007. p. 260-264. ISBN: 978-80-214-3470- 7.Detail
NOVOTNÝ, M.; DVOŘÁK, T.; SZENDIUCH, I. Wire Bonding Power Interconnection. In Proceedings EMPC 2007 the 16th European Microelectronics and Packaging Conference & Exhibition, Part one. Finsko: 2007. p. 92-94. ISBN: 978-952-99751-1- 2.Detail
VAŠKO, C.; NOVOTNÝ, M.; SZENDIUCH, I. Multimedia Learning System - Virtual Lab. In Electronic Devices and System EDS' 2007 Proceeding. Brno: VUT, 2007. p. 473-475. ISBN: 978-80-214-3470- 7.Detail
VAŠKO, C.; SZENDIUCH, I. Process Flow Implementation in Ecological Design. In Electronic Devices and Systems EDS' 2007 Proceedings. Brno: VUT, 2007. p. 369-372. ISBN: 978-80-214-3470- 7.Detail
VANĚK, J.; HLADÍK, J.; SZENDIUCH, I.; VODRÁŽKA, M. The Workplace for Depositing of Thick Film Paste by Direct Writing Technique. In XXXI INTERNATIONAL CONFERENCE IMAPS- POLAND 2007. 1. Rzeszów: Rzeszów University of Technology, 2007. p. 479-481. ISBN: 978-83-917701-4- 6.Detail
ŘEZNÍČEK, M.; SZENDIUCH, I.; ŘEZNÍČEK, Z. Termodynamická senzorika - Nový pohled na monitorování termodynamických systémů. 1. Brno: NOVPRESS s.r.o., 2007. p. 1-22. Detail
2006
Novotný, M., Jakubka, L., Szendiuch, I. Life time simulation of interconnection of sollar cells. In EMPS 2006 Proceedings. Ljublana: TU Slovenia, 2006. p. 381 ( p.)ISBN: 961-91023-4- 7.Detail
Jakubka,L., Novotny,M., Hladik,J., Szendiuch,I. Reliability of solar cell´ s solder joints. In Proceeding of ISSE 2006. Dresden: Heinz Wohlrabe, 2006. p. 72 ( p.)ISBN: 3-934142-23- 0.Detail
Cyril Vaško, Ivan Szendiuch, Luboš Jakubka, Marek Novotný. Eco-Design - New activity in the electronics sector. In 4th European Microelectronics and Packaging Symposium, EMPS 2006 Proceedings. Ljubljana: Midem, 2006. p. 345 ( p.)ISBN: 961-91023-4- 7.Detail
Jiří Hladík, Luboš Jakubka, Ivan Szendiuch. Edge isolation of the silicon solar cells provides by an etching paste. In 3rd International workshop on teaching in photovoltaics. Prague: V. Benda, 2006. p. 65 ( p.)ISBN: 80-01-03467- 4.Detail
J. Hladik, L. Jakubka, I. Szendiuch, R. Barinka. Edge isolation of the silicon solar cells provides by an etching paste. In Proceedings of the 29th International Spring Seminar on Electronics Technology. Dresden: Heinz Wohlrabe, 2006. p. 248 ( p.)ISBN: 3-934142-23- 0.Detail
HLADÍK, J.; BAŘINKA, R.; SZENDIUCH, I. Zanořené kontakty na zadní straně solárních článků použití nestandardních technologií. In 2. česká fotovoltaická konference. Brno: 2006. p. 120 ( p.)ISBN: 80-239-7361- 4.Detail
Jakubka,L., Linhart,J., Szendiuch,I. Thermal cycling and lifetime testing of solar cell’ s solder joints. In EDS 06 IMPAS CS INTERNATIONAL CONFERENCE 2006. Brno: Ing. Zdeněk Novotný CSc., 2006. p. 276 ( p.)ISBN: 80-214-3246- 2.Detail
Jakubka,L., Linhart,J., Szendiuch,I. Screen Printed Diffusion Boron paste. In EDS 06 IMPAS CS INTERNATIONAL CONFERENCE 2006. Brno: Ing. Zdeněk Novotný CSc., 2006. p. 244 ( p.)ISBN: 80-214-3246- 2.Detail
Novotný, M., Szendiuch, I. Simulation of different substrates connection. In Proceedings EDS ' 06. Brno: VUT Brno, 2006. p. 499 ( p.)ISBN: 80-214-3246- 2.Detail
I. Szendiuch, V. Musil, J. Stehlík. Výroba součástek a konstrukčních prvků. Elektronický studijní text. 2006. 84 str., VUT FEKT Brno. Brno: VUT Brno, 2006. p. 1 ( p.)Detail
Řezníček,Z., Tvarožek,V., Szendiuch,I., Řezníček,M. Hybrid Constant Temperature Regulator. In Proceedings of the 7 international conference. Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro- Systems. Como, Itálie: EUROSIME 2006, 2006. p. 194 ( p.)ISBN: 1-4244-0276- X.Detail
Szendiuch,I., Vaško,C., Cejtchaml,P. Lead- free Solder Joint Quality Investigation. In Proceedings of 29th International Spring Seminar on Electronics Technology. Germany: Verlag dr. Markus A. Deter, 2006. p. 84 ( p.)ISBN: 3-934142-23- 0.Detail
Szendiuch,I., Schischke K. Eco-design - new part of technological integration. In Proceedingd of 29th International Spring Seminar on Electronics Technology. Dresden, SRN: Verlag Dr. Markus A. Detert, 2006. p. 166 ( p.)ISBN: 3-934142-23- 0.Detail
Szendiuch,I. Importance of Eco- design Implementation in Engineering Education. In International Conference on Engineering Education. San Juan: Stipest Publishing LLC, 2006. p. 112 ( p.)ISBN: 1-58874-648- 8.Detail
Szendiuch,I., Musil,V. Research and Postgraduate Study in Microelectronics Technology. In International Conference on Engineering Education. San Juan: iNEER, 2006. p. 66 ( p.)ISBN: 1-58874-648- 8.Detail
Szendiuch,I.,Cejtchaml,P. 3D- nové směry v pouzdření. In Bulletin anotací. SMT info. Brno: SMT info konsorcium, 2006. p. 1 ( p.)Detail
Szendiuch,I. Moderní trendy pouzdření v mikroelektronice. In Pájení a tepelné procesy. Bulletin of SMT/ISHM Int. Conference "New Trends in Microelectronics". Brno: SMT info konsorcium, 2006. p. 26 ( p.)ISSN: 1211- 6947.Detail
Doc. Ing. Ivan Szendiuch, CSc. Základy technologie mikroelektronických obvodů a systémů. 1. 1. Brno: VUTIUM, 2006. 396 p. ISBN: 80-214-3292- 6.Detail
Szendiuch,I. Importance of Packaging in Electronics System Design. In EDS´ 06 IMAPS. Brno: Ing. Zdeněk Novotný CSc, 2006. p. 467 ( p.)ISBN: 80-214-3246- 2.Detail
Szendiuch,I. How to Take Decisions for Environmental Design. In EDS ´ 06 IMAPS. EDS´ 06. Brno: Ing. Zdeněk Novotný CSc., 2006. p. 520 ( p.)ISBN: 80-214-3246- 2.Detail
SZENDIUCH, I. Eco- design a jeho implementace do výuku. In 19th International Microworkshop 2006. Mala Lucivna 19.a 20.6.2006: SVŠT Bratislava, 2006. p. 74 ( p.)ISBN: 80-214-3343- 4.Detail
Szendiuch,I., Mach,P. Závěrečná zpráva o řešení grantového projektu "Vývoj mikroelektronických montážních technologiích pro 3D obvody a systémy". Brno: 2006. p. 1 ( p.)Detail
Szendiuch,I.,Hladík,J. Nízkoenergetické struktury pro FV články. Rožnov p.R.: 2006. p. 1 ( p.)Detail
SZENDIUCH, I. Nízkoenergetické struktury FV článků. dílčí zpráva. Rožnov p.R.: MŽP, 2006. p. 0 ( p.)Detail
Jakubka,L., Novotny,M., Szendiuch,I. Realization and Simulation of Interconnection of Solar Cell. In 3rd INTERNATIONAL WORKSHOP ON TEACHING IN PHOTOVOLTAIC, IWTPV´ 06 PROCEEDINGS. Praha: Prof. Vítězslav Benda, PhD., 2006. p. 119 ( p.)ISBN: 80-01-03467- 4.Detail
M. Novotný, L. Jakubka, P. Cejtchaml, I. Szendiuch. Thermomechanical stressing of solar cells. In EUROSIME 2006 Proceeding of the 7 international conference. Commo: Commo, 2006. p. 244 ( p.)ISBN: 1-4244-0276- X.Detail
Cyril Vasko, Jiri Ohera, Ivan Szendiuch. Investigation of solder joints strength. In ISSE 2006 Proceeding. Dresden: TU Dresden, 2006. p. 123 ( p.)ISBN: 3-934142-23- 0.Detail
Novotný M.,Jakubka L.,Szendiuch I. Comparing of flip-chip and wire- bonding interconnection. In 29th International Spring Seminar on Electronics Technology, ISSE 2006. Dresden: TU Dresden, 2006. p. 67 ( p.)ISBN: 00-000-0000- 0.Detail
Jakubka,L., Novotny,M., Szendiuch,I. Interconnection of the back side contact solar cell and the ceramic substrate. In 4th European Microelectronics and Packaging Symposium, EMPS 2006 Proceedings. Ljubljana: Darko Belavič, 2006. p. 387 ( p.)ISBN: 961-91023-4- 7.Detail
2005
Szendiuch,I. Využití nových materiálů v ekodesignu. In Seminář o ekodesignu nejen pro elektrotechnické podniky. Praha: CIR, 2005. p. 1-5. Detail
I. Szendiuch. Promoting Eco-design Activities in the SME´ s. In Promoting Eco- design Activities to the SME. Berlin: FIZM Berlin, 2005. p. 1 ( p.)Detail
Szendiuch,I., Mach,P. Dílčí zpráva o řešení grantového projektu "Vývoj mikroelektronických montážních technologiích pro 3D obvody a systémy". Brno. 2005. p. 1 ( p.)Detail
SZENDIUCH, I. Využití nových materiálů v ekodesignu. Praha: CIR, 2005. p. 14 ( p.)Detail
BULVA, J., SZENDIUCH, I. Comparing of 2D and 3D Modeling of MSM. In 2005 Spanish Conference on Electron Devices. Tarragona, Spain: IEEE, 2005. p. 1 ( p.)ISBN: 0-7803-8811- 9.Detail
BULVA, J., SZENDIUCH, I. Chybí název. 5a Conferencia de Dispositivos Electrónicos. Tarragona: Universitat Rovira i Virgili, 2005. p. 141 ( p.)Detail
NOVOTNÝ, M., SZENDIUCH, I., BULVA, J. Finite Element Modeling of Surface Mount Devices. In Proceedings of ISSE 2005. Wien: TU Wien, 2005. p. 97 ( p.)ISBN: 0-7803-9325- 2.Detail
Jakubka,L., Klumpler,A., Szendiuch,I. Application of Screen Printing by Photovoltaic Cell Realization. In Proceeding of ISSE 2005. Wien: Johann Nicolics, 2005. p. 269 ( p.)ISBN: 0-7803-9325- 2.Detail
Ivan Szendiuch, Jindřich Bulva, Karsten Schischke, Marcel Hageluken. Úvod do strategie návrhu ekologických výrobků. In Seminář o ekologickém návrhu elektrotechnických výrobků. Brno: FEKT VUT, 2005. p. 1 ( p.)Detail | WWW
Jindřich Bulva, Ivan Szendiuch. Seminář o ekologickém návrhu elektrotechnických výrobků. Seminář o ekologickém návrhu elektrotechnických výrobků. Brno: FEKT VUT, 2005. p. 1 ( p.)Detail
Novotný, M., Bulva, J., Szendiuch, I. Thermomechanical stressing of microelectronics structures. In Proceedings EMPC 2005. Brugge: IMAPS BENELUX, 2005. p. 513 ( p.)ISBN: 00-000-0000- 0.Detail
BULVA, J., NOVOTNÝ, M., SZENDIUCH, I. Investigation of Lead- Free Solder Joints Reliability by Thermal Modelling. In 15th European Microelectronics and Packaging Conference & Exhibition. Brugge, Belgium: IMAPS BENELUX, 2005. p. 546 ( p.)Detail
Marek Novotny, Jindrich Bulva, Ivan Szendiuch. Life Time of Surface Mount Devices. In EDS 05 IMAPS CS INTERNATIONAL CONFERENCE PROCEEDINGS. Brno: VUT Brno, 2005. p. 344 ( p.)ISBN: 80-214-2990- 9.Detail
Marek Novotný, Ivan Szendiuch, Cyril Vaško. New trends in packaging. In EDS 05 IMAPS CS INTERNATIONAL CONFERENCE PROCEEDINGS. Brno: VUT Brno, 2005. p. 333 ( p.)ISBN: 80-214-2990- 9.Detail
Jakubka,L., Vasko,C., Szendiuch,I., Hejatkova,E. Properties of Screen Printing Contacts of Solar Cells. In EDS 05 IMPAS CS INTERNATIONAL CONFERENCE PROCEEDINGS. Brno: Ing. Zdeněk Novotný CSc., 2005. p. 305 ( p.)ISBN: 80-214-2990- 9.Detail
Pavel Cejtchaml, Marek Novotný, Ivan Szendiuch. Vlastnosti propojení 3D elektronických systémů. In Mikrosyn. Nové trendy v mikroelektronických systémech a nanotechnologiích. Brno: Z. Novotny, 2005. p. 69 ( p.)ISBN: 80-214-3116- 4.Detail
Marek Novotný, Luboš Jakubka, Cyril Vaško, Ivan Szendiuch. Teplotní namáhání multisubstrátové struktury. In Mikrosyn. Nové trendy v mikroelektronických systémech a nanotechnologiích. Brno: Z. Novotný, 2005. p. 81 ( p.)ISBN: 80-214-3116- 4.Detail
Cyril Vaško, Pavel Cejtchaml, Ivan Szendiuch. Technologie bezolovnatého pájení přetavením. In Mikrosyn. Nové trendy v mikroelektronických systémech a nanotechnologiích. Brno: Z. Novotny, 2005. p. 75 ( p.)ISBN: 80-214-3116- 4.Detail
ADÁMEK, M.; PRÁŠEK, J.; MELICHAR, P.; SZENDIUCH, I.; JAKUBKA, L. Sensor for lowest flows measurement. In Proceedings of ISSE 2005. Wiener Neustadt, Austria: Institute of Sensor and Actuator Systems, Vienna University of Technology, 2005. p. 29-33. ISBN: 0-7803-9325- 2.Detail
Jakubka,L. Fotovoltaické články jako součást elektronického systému. In Elektrotechnika a informatika 2005. Plzeň: Západočeská universita v Plzni, 2005. p. 23 ( p.)ISBN: 80-7043-375- 2.Detail
Jakubka, L., Hladík, J., Novotný, M., Vaško, C., Szendiuch, I. Testování životnosti kontaktů solárních článků. In Mikrosyn. Nové trendy v mikroelektronických systémech a nanotechnologiích. Sborník seminare. Brno: Ing. Zdeněk Novotný CSc., 2005. p. 89 ( p.)ISBN: 80-214-3116- 4.Detail
HLADÍK, J.; JAKUBKA, L.; SZENDIUCH, I. Izolace hrany Si solárního článku leptací pastou. In Mikrosyn. Nové trendy v mikroelektronických systémech a nanotechnologiích. Sborník seminare. Brno: Ing. Zdeněk Novotný CSc., 2005. p. 85 ( p.)ISBN: 80-214-3116- 4.Detail
Josef Šandera, Luboš Jakubka, Ivan Szendiuch. Spojování solárních řezů. In Mikrosyn. Nové trendy v mikroelektronických systémech a nanotechnologiích. Sborník seminare. Brno: Ing. Zdeněk Novotný CSc., 2005. p. 101 ( p.)ISBN: 80-214-3116- 4.Detail
Ivan Szendiuch, Cyril Vaško, Marek Novotný, Luboš Jakubka, Pavel Cejtchaml. Eco-Design Management. In Mikrosyn. Nové trendy v mikroelektronických systémech a nanotechnologiích. Sborník seminare. Brno: Nakl. Z. Novotny, 2005. p. 65 ( p.)ISBN: 80-214-3116- 4.Detail
SZENDIUCH, I. Úvod do strategie ekologických výrobků - článek. In Seminář o ekologickém návrhu elektrotechnických výrobků. Brno: VUT v Brně, 2005. p. 5-15. Detail
SZENDIUCH, I. Ekologie a elektronická výroba. In Výroba DPS, Materiály pro montážní technologie, Čistění DPS. Bulletin of SMT/ISHM Int. Conference "New Trends in Microelectronics". Brno: SMT- info konsorcium, 2005. p. 25 ( p.)ISSN: 1211- 6947.Detail
Jiří Starý, Ivan Szendiuch. Lead Free Solder Material Compatibility and Technological Factors. In Conference Proceedings ISSE 2005. Vienna: 2005. p. 78 ( p.)ISBN: 0-7803-9325- 2.Detail
Szendiuch,I. Quality Implementation in Microelectronics Technology Education. In EDS¨05, IMAPS CS, International Conference Proceedings. Brno: VUT Brno, 2005. p. 355 ( p.)ISBN: 80-214-2990- 9.Detail
Szendiuch,I., Vaško,C. Eco-Design Management vs. Quality Management. In EDS¨05 IMAPS CS, International Conference Proceedings. Brno: VUT Brno, 2005. p. 361 ( p.)ISBN: 80-214-2990- 9.Detail
Szendiuch,I. Implementation of Eco- design in the Electronic Sector. In Proceedings of IMAPS Nordic Conference. Kiiminiki: 2005. p. 104 ( p.)ISBN: 951-98002-7- 1.Detail
Szendiuch,I. Quality Implementation in Microelectronics Technology Education. In Proceedings of 8th Academic Conference. Wien: TU Wien, 2005. p. 100 ( p.)ISBN: 0-7803-9325- 2.Detail
Szendiuch,I. Multidisciplinary Matter of Microelectronics Technology Education. In Proceedings Intational Conference on Engineering Education. International Conference on Engineering Education and Research "Progress Through Partnership". Gliwice: Silisian University of Technology, 2005. p. 468 ( p.)ISSN: 1562- 3580.Detail
Szendiuch,I. Eco-design - nová strategie návrhu II. Sdělovací technika, 2005, vol. 2005, no. 10, p. 3 ( p.)ISSN: 0036- 9942.Detail
Szendiuch,I. Eco-design- nová strategie návrhu I. Sdělovací technika, 2005, vol. 2005, no. 9, p. 3 ( p.)ISSN: 0036- 9942.Detail
Szendiuch,I. Technologické trendy na počátku XXI. století. Sdělovací technika, 2005, vol. 2005, no. 4, p. 3 ( p.)ISSN: 0036- 9942.Detail
2004
BULVA, J., SZENDIUCH, I. Optimizing of Solder Joint Reliability by 3D Modeling. In Proceedings of 3rd Microelectronics and Packaging Symposium with Table Top Exhibition. Lanskroun: IMAPS CZ& SK Chapter, 2004. p. 195 ( p.)ISBN: 80-239-2835- X.Detail
SZENDIUCH, I., ŠANDERA, J. FR4-ceramic "Z axis" solder joint reliability. In EMPS 2004. Praha: IMAPS, 2004. p. 687 ( p.)ISBN: 80-239-2835- X.Detail
PRÁŠEK, J., ADÁMEK, M., HUBÁLEK, J., SZENDIUCH, I. New Thick Film Sensor Design and Its Material Optimization For Heavy Metals Detection. In 11th Electronic Devices and Systems Conference 2004 Proceedings. Brno: Vysoké učení technické v Brně, Antonínská 548/ 1, 2004. p. 345 ( p.)ISBN: 80-214-2701- 9.Detail
BULVA, J., SZENDIUCH, I. 2D Modelling of Stresses in Solder Joint Connection. In 11th Electronic Devices and Systems Conference 2004 Proceedings. Brno: Ing. Zdeněk Novotný CSc., Brno, 2004. p. 377 ( p.)ISBN: 80-214-2701- 9.Detail
ŠANDERA, J., SZENDIUCH, I. FR4-Ceramic "Z" Axis Solder Interconnection. Journal of Electrical Engineering, 2004, vol. 55, no. 9- 10, p. 256 ( p.)ISSN: 1335- 3632.Detail
SZENDIUCH, I. Lead- free Legislation in Electronics Industry. In 11th Electronic Devices and Systems Conference 2004 Proceedings. Brno: Ing. Zdeněk Novotný CSc., Brno, 2004. p. 403 ( p.)ISBN: 80-214-2701- 9.Detail
SZENDIUCH, I., BULVA, J. Wettability SnPb and Lead- free. In 11th Electronic Devices and Systems Conference 2004 Proceedings. Brno: Ing. Zdeněk Novotný CSc., Brno, 2004. p. 407-411. ISBN: 80-214-2701- 9.Detail
SZENDIUCH, I. Investigation of Creep and Stress Relaxation of Lead- free Solder Joints. In 37th IMAPS Symposium on Microelectronics. Long Beach: IMAPS USA, 2004. p. 1- 10 ( p.)ISBN: 0-930815-74- 2.Detail
SZENDIUCH, I., STARÝ, J. Some New Results from Investigation of Lead- free Solders Application. In Proceedings of IMAPS Nordic 2004 Annual Conference. Helsingor, Denmark: IMAPS Nordic, 2004. p. 49 ( p.)ISBN: 951-98002-6- 3.Detail
SZENDIUCH, I. Sítotisk a jeho perspektivy v nanoelektronice. Bulletin of SMT/ISHM Int. Conference "New Trends in Microelectronics", 2004, vol. 2004, no. 45, p. 3 ( p.)ISSN: 1211- 6947.Detail
SZENDIUCH, I. Cleaning of Electronic Assemblies - a Modular Approach. In Proceedings of 3rd European Microelectronics and Packaging. Praha: IMAPS, 2004. p. 305 ( p.)ISBN: 80-239-2835- X.Detail
SZENDIUCH, I. Soldering and lead free solders. Sdělovací technika, 2004, vol. 2004, no. 6, p. 3 ( p.)ISSN: 0036- 9942.Detail
SZENDIUCH, I. Czech Electronics Sector and Education. In IMAPS Nordic Proceedings. Helsingor: IMAPS Nordic, 2004. p. 232- 7 ( p.)ISBN: 951-98002-6- 3.Detail
SZENDIUCH, I. Nové trendy v mikroelektronice a EU. Bulletin of SMT/ISHM Int. Conference "New Trends in Microelectronics", 2004, vol. 2004, no. 45, p. 5 ( p.)ISSN: 1211- 6947.Detail
SZENDIUCH, I. Bezolovnaté pájení. Dny čs techniky, BVV Brno 22.9.2004, Pavilon A. ČR: BVV Brno, 2004. p. 0 ( p.)Detail
SZENDIUCH, I. Chybí název. IMAPS Czech & Slovak Chapter Workshop. Lanškroun: IMAPS Czech & Slovak Chapter, 2004. p. 0-0. Detail
SZENDIUCH, I. Moderní elektronika, bezolovnaté pájení a směrnice EU. In Moderní elektronické součástky 2004. Sborník přednášek, Kongresová hala Holiday Inn, 24. a 25.11. 2004. Brno: Sdělovací technika, 2004. p. 11 ( p.)Detail
SZENDIUCH, I., STARÝ, J. To the Lead free Soldering Application Process. International Microelectronics and Packaging Society Workshop. Lanškroun: IMAPS, 2004. p. 1 ( p.)Detail
ADÁMEK, M., PRÁŠEK, J., SZENDIUCH, I. The Comparison of Working Electrode Materials for TFT Chemical Sensors. In 11th Electronic Devices and Systems Conference 2004 Proceedings. Brno: Vysoké učení technické v Brně, Antonínská 548/ 1, 2004. p. 317 ( p.)ISBN: 80-214-2701- 9.Detail
2003
SZENDIUCH, I., BULVA, J. Solder Joint Quality. In Proceedings of 10- th Electronic Devices and Systems Conference 2003. Neuveden. Brno: Ing. Zdeněk Novotný, CSc., Brno, 2003. p. 388 ( p.)ISBN: 80-214-2452- 4.Detail
SZENDIUCH, I. Mikroelektronika a technologie součástek. Brno: 2003. p. 1 ( p.)Detail | WWW
BULVA, J., SZENDIUCH, I. Modelling of 3D Multimodule Substrate. In Proceedings of 27-th International Conference and Exhibition IMAPS- Poland 2003. Neuveden. Gliwice, Poland: International Microelectronics and Packaging Society Poland- Chapter, 2003. p. 126 ( p.)ISBN: 83-917701-0- 9.Detail
BULVA, J., SZENDIUCH, I. Influence of Bump Height to Multisubstrate Structures Construction. In Proceedings of 10- th Electronic Devices and Systems Conference 2003. Neuveden. Brno: Ing. Zdeněk Novotný CSc., Brno, 2003. p. 377 ( p.)ISBN: 80-214-2452- 4.Detail
MUSIL, V., FUJCIK, L., MATOUŠEK, V., SZENDIUCH, I. Regulatory requirements for medical equipment. In Proceedings of the Socrates Workshop. Short Contributions. Brno: Zd. Novotný, 2003. p. 179 ( p.)ISBN: 80-214-2461- 3.Detail
MUSIL, V., SZENDIUCH, I., SKOČDOPOLE, M., BEČVÁŘ, D., BRZOBOHATÝ, J. Ion radiation hazards for FPGAs. In Proceedings of the Socrates Workshop. Short Contributions. Zd. Novotný, 2003. p. 187 ( p.)ISBN: 80-214-2161- 3.Detail
STARÝ, J., SZENDIUCH, I. Some Aspects of Lead Free Soldering. In ISSE 2003 Conference Proceedings. High Tatras, Slovak Republic: ETC Grafo Brix, 2003. p. 175 ( p.)ISBN: 0-7803-8002- 9.Detail
HEJÁTKOVÁ, E., SZENDIUCH, I., ADÁMEK, M., DRLÍK, M. Mikroelektronika a technologie součástek, lab. cvičení. Brno: 2003. p. 1 ( p.)Detail | WWW
SZENDIUCH, I. Introduction of PERT Model for Microelectronics Technology Education. In ISSE 2003 Conference Proceedings. High Tatras, Slovak Republic: ETC Grafo Brix, 2003. p. 121 ( p.)ISBN: 0-7803-8002- 9.Detail
SZENDIUCH, I., PROCHÁZKA, T. Resonators Embedded In LTCC. In ISSE 2003 Conference Proceedings. High Tatras, Slovakia: ETC Grafo Brix, 2003. p. 145 ( p.)ISBN: 0-7803-8002- 9.Detail
SZENDIUCH, I. The Cleaning Importance in Microelectronics Technology. In ISSE 2003 Conference Proceeding. High Tatras, Slovak Republic: ETC Grafo Brix, 2003. p. 499 ( p.)ISBN: 0-7803-8002- 9.Detail
SZENDIUCH, I. Some New Aspects in Microelectronics Assembly Technology Education. In 53rd ECTC, International workshop on Microelectronics Packaging Education. New Orleans, USA: IEEE, 2003. p. 12 ( p.)ISBN: 0-7803-7992- 3.Detail
ŠANDERA, J., SZENDIUCH, I. Cheep Solution for MSM (MMS). In 14th European Microelectronics and Packaging Conference. Friedrichshafen, BRD: IMAPS Germany, 2003. p. 436 ( p.)Detail
SZENDIUCH, I. Packaging Trends and Development. In EDS´ 03. Brno: 2003. p. 382 ( p.)ISBN: 80-214-2452- 4.Detail
SZENDIUCH, I., ADÁMEK, M., HEJÁTKOVÁ, E. Education in Microelectronics Technology. In EDS´ 03. Brno: 2003. p. 79 ( p.)ISBN: 80-214-2452- 4.Detail
SZENDIUCH, I. Some Aspects to Lead- free Solder Wettability. In Proceeding of the Socrates Workshop 2003. Kréta: 2003. p. 66 ( p.)ISBN: 80-214-2461- 3.Detail
SZENDIUCH, I. Trends in Packaging and Lead- free Solders. Bulletin of SMT/ISHM Int. Conference "New Trends in Microelectronics", 2003, vol. 2003, no. 43, p. 3 ( p.)ISSN: 1211- 6947.Detail
SZENDIUCH, I. Electronics and Human Health. Bulletin of SMT/ISHM Int. Conference "New Trends in Microelectronics", 2003, no. 43, p. 3 ( p.)ISSN: 1211- 6947.Detail
SZENDIUCH, I. Lead-free Soldering - when will be comming?. In Proceedings of the Socrates Workshop 2003. Crete, Greece: Technological Institute of Crete, 2003. p. 61 ( p.)ISBN: 80-214-2461- 3.Detail
ADÁMEK, M., SZENDIUCH, I. Some Aspects Influencing Printing Process. In 10th Electronic Devices and Systems Conference 2003 Proceedings. Neuveden. Brno: 2003. p. 371 ( p.)ISBN: 80-214-2452- 4.Detail
2002
BÍLEK, J., SZENDIUCH, I. Teplotní modelování v elektronických obvodech a systémech. Bulletin of SMT/ISHM Int. Conference "New Trends in Microelectronics", 2002, no. 39, p. 9 ( p.)ISSN: 1211- 6947.Detail
SZENDIUCH, I., STARÝ, J. Investigation of Lead free soldering. IMAPS Czech and Slovak Chapter, 2002. p. 1 ( p.)Detail
SZENDIUCH, I. The Czech Electronics Sector and Education Importance. In ELECTRONIC DEVICES AND SYSTEMS 02 - PROCEEDINGS. Brno: Vysoké učení technické v Brně, 2002. p. 137 ( p.)ISBN: 80-214-2180- 0.Detail
SZENDIUCH, I. MSM realized by Thick Film Technology. In ELECTRONIC DEVICES AND SYSTEMS 02 - PROCEEDINGS. Brno: Vysoké učení technické v Brně, 2002. p. 211 ( p.)ISBN: 80-214-2180- 0.Detail
SZENDIUCH, I. Trendy montážních technologií v mikroelektronice. Sdělovací technika, 2002, vol. 2002, no. 8, p. 3 ( p.)ISSN: 0036- 9942.Detail
SZENDIUCH, I., BAZALKA, M. Application of SPC and IPO in Small Electronic Production. In Proc. 2nd European Microelectronics Packaging and Interconnection Symposium " IMAPS Europe Cracow 2002. Cracow, Poland: IMAPS Europe, 2002. p. 334 ( p.)ISBN: 83-904462-8- 6.Detail
SZENDIUCH, I., BÍLEK, J. Actual Development in the Czech Electronics Sector. In Proceedings of The IMAPS Nordic Annual Conference Stockholm, 2002. Kiiminki, Finland: Pelkosen Painotuote, 2002. p. 44 ( p.)ISBN: 951-98002-4- 7.Detail
SZENDIUCH, I., ŠANDERA, J., BÍLEK, J. Multi Substrate Modules – Cheap Solution for 3D Packaging. In Proceedings of The IMAPS Nordic Annual Conference Stockholm, 2002. Kiiminki, Finland: Pelkosen Painotuote, 2002. p. 114 ( p.)ISBN: 951-98002-4- 7.Detail
SZENDIUCH, I. MSM - Nové možnosti v konstrukci elektronických systémů. Bulletin of SMT/ISHM Int. Conference "New Trends in Microelectronics", 2002, vol. 02, no. 37, p. 25 ( p.)ISSN: 1211- 6947.Detail
SZENDIUCH, I. New Approach to Microelectronics Assembly Technologies Education. In Socrates Workshop 2002 - Proceedings. Intensive Training Programme in Electronic System Design. Brno: Ing. Zdeněk Novotný,CSc., 2002. p. 44 ( p.)ISBN: 80-214-2217- 3.Detail
SZENDIUCH, I. Využití bezolovnatých pájek při konstrukci MSM. Bulletin of SMT/ISHM Int. Conference "New Trends in Microelectronics", 2002, no. 39, p. 13 ( p.)ISSN: 1211- 6947.Detail
SZENDIUCH, I. Plošné spoje a co dále?. Bulletin of SMT/ISHM Int. Conference "New Trends in Microelectronics", 2002, vol. 2002, no. 37, p. 14 ( p.)ISSN: 1211- 6947.Detail
SZENDIUCH, I. MSM System in Package - One Way to System Integration. In ISSE 2002. Praha: TYPOS- Digital Print, 2002. p. 266 ( p.)ISBN: 0-7803-9824- 6.Detail
SZENDIUCH, I., BÍLEK, J. Teplotní modelování v elektronických obvodech a systémech. 2002, p. 21 ( p.)Detail
SZENDIUCH, I. a kol. Technologie elektronických obvodů a systémů. GA102/00/ 0969. GA102/00/ 0969. Brno: Nakladatelství VUTIUM, Brno, 2002. 289 p. ISBN: 80-214-2072- 3.Detail
2001
SZENDIUCH, I., PIVOVAR, T. The Complex Management of Microlectronic Production - The Production Quality. In Proc. of EDS' 98. Brno: FEECS, TU Brno, 2001. p. 370-373. ISBN: 80-214- 119.Detail
ADÁMEK, M., KREJČÍ, J., SZENDIUCH, I. The Dependance of TFT Chemical Sensors on the Technology of Preparation Methods of Testing. In Proceedings of 34th IMAPS Interantional Sympozium. Baltimore, USA: IMAPS USA, 2001. p. 688-692. ISBN: 0-930815-64- 5.Detail
MALYSZ, K., SZENDIUCH, I. Inexpensive Process for Flip Chip Manufacturing. In Proceedings of 34th IMAPS International Sympozium. Baltimore, USA: IMAPS USA, 2001. p. 736 ( p.)ISBN: 0-930815-64- 5.Detail
BÍLEK, J., SZENDIUCH, I. Model of Temperature Distribution of Thick Film Heating Element. In Electronic Devices and Systems 2001. Brno, Czech Republic: Ing. Zdeněk Novotný, CSc., Brno, 2001. p. 248 ( p.)ISBN: 80-214-1960- 1.Detail
SZENDIUCH, I., ŠANDERA, J. Soldering and lead free solders. Brno: 2001. p. 89 ( p.)Detail
SZENDIUCH, I. K některým otázkám souvisejícím s problematikou součástek 0201. 2001, vol. 02, no. 01, p. 9 ( p.)Detail
SZENDIUCH, I. Odborný posudek : ČSN EN 60352- 5 Nepájené spoje. 2001.Detail
SZENDIUCH, I. Wafer-level packaging vs. chip- level Packaging. In Intensive Training Programme in Electronic System Design, Proceedings. Brno: Ing. Zdeněk Novotný, 2001. p. 54 ( p.)Detail
SZENDIUCH, I. New Approach to Quality Control in Small Electrotechnical Companies. In Proceedings IMAPS Strabourg 2001. Strasbourg: IMAPS Europe, 2001. p. 422 ( p.)ISBN: 80-238-5509- 3.Detail
HLAVÁČ, R., SZENDIUCH, I. Lead- Free Implementation Issue. In Intensive Trainning Programme in Electronic System Design. Brno: Ing. Zdeněk Novotný, 2001. p. 54 ( p.)ISBN: 80-214-2027- 8.Detail
SZENDIUCH, I. Inexpensive Process for Flip- Chip Manufacturing. In 2001.Detail
SZENDIUCH, I. The Dependence of TFT Chemical Sensors on the Technology of Preparation Methods of Testing. In Proceedings 2001 International Symposium on Microelectronics. USA: IMAPS, 2001. p. 688-692. ISBN: 0-930815-64- 5.Detail
SZENDIUCH, I. Inexpensive Process for Flip Chip Manufacturing. In Proceedings 2001 International Symposium on Microelectronics. USA: IMAPS, 2001. p. 736 ( p.)ISBN: 0-930815-64- 5.Detail
SZENDIUCH, I. Chip Level Packaging - New Way to Higher Integration. 2001, vol. 06, no. 33, p. 9 ( p.)Detail
2000
MALYSZ, K., SZENDIUCH, I. Aplikace pájení v parách pro technologii Flip- Chip. In 20 let Ústavu mikroelektroniky FEI VUT v Brně. první. Brno: Nakladatelství Ing. Zdeněk Novotný, Csc., 2000. p. 120 ( p.)ISBN: 80-214-1781- 1.Detail
ADÁMEK, M., KREJČÍ, J., SZENDIUCH, I. Temperature characteristic of thick film sensors and biosensors. In IMAPS - EUROPE PRAGUE 2000, Symposium Proceedings. Neuveden. Praha: 2000. p. 379-382. ISBN: 80-238-5509- 3.Detail
SZENDIUCH, I. Nové aspekty ve vedení signálů v elektronických systémech. In Sborník Vědecké konference s mezinárodní účastí "Nové smery v spracování signálov V.". Liptovský Mikuláš: Nové smery v spracování signálov, 2000. p. 36 ( p.)ISBN: 80-8040-125- 1.Detail
SZENDIUCH, I. Integral Documentation Role Introducing TQM into Small Electrotecnical Companies. In Proc. 1st European Microelectronics Packaging and Interconnection Symposium "IMAPS-Europe Prague 2000". Praha: IMAPS Europe, 2000. p. 422 ( p.)ISBN: 80-238-5509- 3.Detail
SZENDIUCH, I. Impact of Technological Integration on Actual Development in Electronics. In Proc. XXIV. International Conference IMAPS Poland. Rytro: IMAPS, 2000. p. 107 ( p.)ISBN: 83-904462-5- 1.Detail
ADÁMEK, M., KREJČÍ, J., SZENDIUCH, I. Temperature characteristic of thick film electrochemical sensors. In Electronic Devices and Systems EDS' Y2K Proceedings. Neuveden. Brno: 2000. p. 251-254. ISBN: 80-214-1780- 3.Detail
1993
SZENDIUCH, I.; KOČÍ, F. Spolehlivost pájených spojů v povrchobé montáži. In Spolehlivost pájených spojů v povrchobé montáži. Brno: ISHM Czech and Slovak Chapter, 1993. p. 1 ( p.)Detail
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